XC7S15-1CPGA196C
vs
XC7S15-1CSGA225Q
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
TFBGA, BGA196,14X14,20
|
LFBGA, BGA225,15X15,32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
65 Weeks
|
65 Weeks
|
| Date Of Intro |
2016-11-15
|
|
| Clock Frequency-Max |
1098 MHz
|
1098 MHz
|
| Combinatorial Delay of a CLB-Max |
1.27 ns
|
1.27 ns
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B225
|
| JESD-609 Code |
e1
|
e1
|
| Length |
8 mm
|
13 mm
|
| Number of CLBs |
1000
|
1000
|
| Number of Inputs |
100
|
100
|
| Number of Logic Cells |
12800
|
12800
|
| Number of Outputs |
100
|
100
|
| Number of Terminals |
196
|
225
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1000 CLBS
|
1000 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA196,14X14,20
|
BGA225,15X15,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.1 mm
|
1.4 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8 mm
|
13 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare XC7S15-1CPGA196C with alternatives
Compare XC7S15-1CSGA225Q with alternatives