XC7S15-1CSGA225Q vs XC7S15-1TQGA144I feature comparison

XC7S15-1CSGA225Q AMD Xilinx

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XC7S15-1TQGA144I AMD

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Package Description LFBGA, BGA225,15X15,32 TQGA-144
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B144
JESD-609 Code e1
Length 13 mm
Number of CLBs 1000 1000
Number of Inputs 100
Number of Logic Cells 12800
Number of Outputs 100
Number of Terminals 225 144
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 1000 CLBS 1000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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