XC7S15-1CSGA225Q vs XC7S15-1CPGA196I feature comparison

XC7S15-1CSGA225Q AMD Xilinx

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XC7S15-1CPGA196I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description LFBGA, BGA225,15X15,32 TFBGA, BGA196,14X14,20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B196
JESD-609 Code e1 e1
Length 13 mm 8 mm
Number of CLBs 1000 1000
Number of Inputs 100 100
Number of Logic Cells 12800 12800
Number of Outputs 100 100
Number of Terminals 225 196
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1000 CLBS 1000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA225,15X15,32 BGA196,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.4 mm 1.1 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 8 mm
Base Number Matches 2 2
Date Of Intro 2016-11-15
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare XC7S15-1CPGA196I with alternatives