XC7S15-1CPGA196C vs XC7S15-1CSGA225Q feature comparison

XC7S15-1CPGA196C AMD Xilinx

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XC7S15-1CSGA225Q AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description TFBGA, BGA196,14X14,20 LFBGA, BGA225,15X15,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Date Of Intro 2016-11-15
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B196 S-PBGA-B225
JESD-609 Code e1 e1
Length 8 mm 13 mm
Number of CLBs 1000 1000
Number of Inputs 100 100
Number of Logic Cells 12800 12800
Number of Outputs 100 100
Number of Terminals 196 225
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C
Organization 1000 CLBS 1000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA196,14X14,20 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.1 mm 1.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 13 mm
Base Number Matches 1 1

Compare XC7S15-1CPGA196C with alternatives

Compare XC7S15-1CSGA225Q with alternatives