XC7A200T-1SB484I vs XC7A200T-1SBG484C feature comparison

XC7A200T-1SB484I AMD Xilinx

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XC7A200T-1SBG484C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 19 X 19 MM, 0.80 MM PITCH, FBGA-484
Pin Count 484 484
Reach Compliance Code unknown compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 19 mm
Number of CLBs 16825 16825
Number of Inputs 285 285
Number of Logic Cells 215360 215360
Number of Outputs 285 285
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 19 mm 19 mm
Base Number Matches 2 2
Pbfree Code Yes
Clock Frequency-Max 1098 MHz
Moisture Sensitivity Level 4
Qualification Status Not Qualified
Technology CMOS
Temperature Grade OTHER

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Compare XC7A200T-1SBG484C with alternatives