XC7A200T-1SBG484C
vs
XC7A200T-1FBG484C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Pin Count
484
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Factory Lead Time
65 Weeks
16 Weeks
Clock Frequency-Max
1098 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
1.27 ns
1.27 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Length
19 mm
23 mm
Moisture Sensitivity Level
4
4
Number of CLBs
16825
16825
Number of Inputs
285
285
Number of Logic Cells
215360
215360
Number of Outputs
285
285
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
16825 CLBS
16825 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
BGA
Package Equivalence Code
BGA484,22X22,32
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.54 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
23 mm
Base Number Matches
2
2
Samacsys Manufacturer
AMD
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