XC6SLX16-2CSG324I vs XC6SLX16-2FT256C feature comparison

XC6SLX16-2CSG324I AMD Xilinx

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XC6SLX16-2FT256C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count 324 256
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.26 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B256
JESD-609 Code e1 e0
Length 15 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1139 1139
Number of Inputs 232 186
Number of Logic Cells 14579 14579
Number of Outputs 232 186
Number of Terminals 324 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1139 CLBS 1139 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LBGA
Package Equivalence Code BGA324,18X18,32 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm 17 mm
Base Number Matches 1 1

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