XC6SLX16-2FT256C vs XC6SLX16-2CSG225C feature comparison

XC6SLX16-2FT256C AMD Xilinx

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XC6SLX16-2CSG225C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count 256 225
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.26 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B225
JESD-609 Code e0 e1
Length 17 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1139 1139
Number of Inputs 186 160
Number of Logic Cells 14579 14579
Number of Outputs 186 160
Number of Terminals 256 225
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1139 CLBS 1139 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LFBGA
Package Equivalence Code BGA256,16X16,40 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 13 mm
Base Number Matches 1 1

Compare XC6SLX16-2FT256C with alternatives

Compare XC6SLX16-2CSG225C with alternatives