XC6SLX150-3FGG900C vs XC6SLX150-2FG900I feature comparison

XC6SLX150-3FGG900C AMD Xilinx

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XC6SLX150-2FG900I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900 31 X 31 MM, 1 MM PITCH, BGA-900
Pin Count 900 900
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.26 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 11519 11519
Number of Inputs 570 570
Number of Logic Cells 147443 147443
Number of Outputs 570 570
Number of Terminals 900 900
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 11519 CLBS 11519 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1

Compare XC6SLX150-3FGG900C with alternatives

Compare XC6SLX150-2FG900I with alternatives