XC6SLX150-2FG900I
vs
XC6SLX150-2FGG900C
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
31 X 31 MM, 1 MM PITCH, BGA-900
|
31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| Factory Lead Time |
12 Weeks
|
12 Weeks
|
| Clock Frequency-Max |
667 MHz
|
667 MHz
|
| Combinatorial Delay of a CLB-Max |
0.26 ns
|
0.26 ns
|
| JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B900
|
| JESD-609 Code |
e0
|
e1
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
11519
|
11519
|
| Number of Inputs |
570
|
570
|
| Number of Logic Cells |
147443
|
147443
|
| Number of Outputs |
570
|
570
|
| Number of Terminals |
900
|
900
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
11519 CLBS
|
11519 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA900,30X30,40
|
BGA900,30X30,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
AMD
|
|
|
|