XC6SLX150-2FG900I vs XC6SLX150-3FGG900I feature comparison

XC6SLX150-2FG900I AMD Xilinx

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XC6SLX150-3FGG900I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1 MM PITCH, BGA-900 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900
Pin Count 900 900
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.21 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 11519 11519
Number of Inputs 570 576
Number of Logic Cells 147443 147443
Number of Outputs 570 576
Number of Terminals 900 900
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 11519 CLBS 11519 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 2 2

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Compare XC6SLX150-3FGG900I with alternatives