XC4VLX25-11FF668IS2
vs
XC4VLX25-11FF668I096
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
|
Ihs Manufacturer |
XILINX INC
|
|
Reach Compliance Code |
not_compliant
|
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
1205 MHz
|
|
Combinatorial Delay of a CLB-Max |
0.17 ns
|
|
JESD-30 Code |
S-PBGA-B668
|
|
JESD-609 Code |
e0
|
|
Moisture Sensitivity Level |
4
|
|
Number of Inputs |
448
|
|
Number of Logic Cells |
24192
|
|
Number of Outputs |
448
|
|
Number of Terminals |
668
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2688 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA668,26X26,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Max |
1.26 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
|
|
|
|
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