XC4VLX25-11FF668IS2 vs XC4VLX25-11FFG668IS2 feature comparison

XC4VLX25-11FF668IS2 AMD Xilinx

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XC4VLX25-11FFG668IS2 AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1205 MHz 1205 MHz
Combinatorial Delay of a CLB-Max 0.17 ns 0.17 ns
JESD-30 Code S-PBGA-B668 S-PBGA-B668
JESD-609 Code e0 e1
Moisture Sensitivity Level 4 4
Number of Inputs 448 448
Number of Logic Cells 24192 24192
Number of Outputs 448 448
Number of Terminals 668 668
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2688 CLBS 2688 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA668,26X26,40 BGA668,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1

Compare XC4VLX25-11FF668IS2 with alternatives

Compare XC4VLX25-11FFG668IS2 with alternatives