XC4VLX25-10SF363I
vs
XC4VLX25-10SFG363IS2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
|
| Package Description |
FBGA-363
|
FBGA, BGA363,20X20,32
|
| Pin Count |
363
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
52 Weeks
|
|
| Clock Frequency-Max |
1028 MHz
|
1028 MHz
|
| JESD-30 Code |
S-PBGA-B363
|
S-PBGA-B363
|
| JESD-609 Code |
e0
|
e1
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
2688
|
|
| Number of Inputs |
240
|
240
|
| Number of Logic Cells |
24192
|
24192
|
| Number of Outputs |
240
|
240
|
| Number of Terminals |
363
|
363
|
| Organization |
2688 CLBS
|
2688 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA363,20X20,32
|
BGA363,20X20,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.99 mm
|
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
|
| Base Number Matches |
2
|
1
|
| Combinatorial Delay of a CLB-Max |
|
0.2 ns
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
|
|
|
Compare XC4VLX25-10SF363I with alternatives
Compare XC4VLX25-10SFG363IS2 with alternatives