XC4VLX25-10SFG363IS2
vs
XC4VLX25-10SF363CS2
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Package Description |
FBGA, BGA363,20X20,32
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
1028 MHz
|
1028 MHz
|
Combinatorial Delay of a CLB-Max |
0.2 ns
|
0.2 ns
|
JESD-30 Code |
S-PBGA-B363
|
S-PBGA-B363
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
4
|
4
|
Number of Inputs |
240
|
240
|
Number of Logic Cells |
24192
|
24192
|
Number of Outputs |
240
|
240
|
Number of Terminals |
363
|
363
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2688 CLBS
|
2688 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA363,20X20,32
|
BGA363,20X20,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC4VLX25-10SFG363IS2 with alternatives
Compare XC4VLX25-10SF363CS2 with alternatives