XC4VLX25-10SFG363IS2
vs
XC4VLX25-10SF363CS2
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Package Description
FBGA, BGA363,20X20,32
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1028 MHz
1028 MHz
Combinatorial Delay of a CLB-Max
0.2 ns
0.2 ns
JESD-30 Code
S-PBGA-B363
S-PBGA-B363
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
4
4
Number of Inputs
240
240
Number of Logic Cells
24192
24192
Number of Outputs
240
240
Number of Terminals
363
363
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2688 CLBS
2688 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA363,20X20,32
BGA363,20X20,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
1.99 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
1
1
Compare XC4VLX25-10SFG363IS2 with alternatives
Compare XC4VLX25-10SF363CS2 with alternatives