XC4VLX25-10SFG363IS2 vs XC4VLX25-10SF363CS2 feature comparison

XC4VLX25-10SFG363IS2 AMD Xilinx

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XC4VLX25-10SF363CS2 AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Package Description FBGA, BGA363,20X20,32
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1028 MHz 1028 MHz
Combinatorial Delay of a CLB-Max 0.2 ns 0.2 ns
JESD-30 Code S-PBGA-B363 S-PBGA-B363
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 4 4
Number of Inputs 240 240
Number of Logic Cells 24192 24192
Number of Outputs 240 240
Number of Terminals 363 363
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2688 CLBS 2688 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA363,20X20,32 BGA363,20X20,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.99 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1

Compare XC4VLX25-10SFG363IS2 with alternatives

Compare XC4VLX25-10SF363CS2 with alternatives