XC4VLX25-10SFG363IS2 vs XC4VLX25-10SF363C0968 feature comparison

XC4VLX25-10SFG363IS2 AMD Xilinx

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XC4VLX25-10SF363C0968

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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA363,20X20,32
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Clock Frequency-Max 1028 MHz
Combinatorial Delay of a CLB-Max 0.2 ns
JESD-30 Code S-PBGA-B363
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 4
Number of Inputs 240
Number of Logic Cells 24192
Number of Outputs 240
Number of Terminals 363
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 2688 CLBS
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA363,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.99 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm
Base Number Matches 1

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