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XC4085XL-2BG560I vs XC4085XL-2BGG560C feature comparison

XC4085XL-2BG560I AMD Xilinx

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XC4085XL-2BGG560C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-560 LBGA,
Pin Count 560 560
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 85000 LOGIC GATES MAX USABLE 85000 LOGIC GATES
Clock Frequency-Max 179 MHz 179 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1.5 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 3136
Number of Equivalent Gates 55000 55000
Number of Inputs 448 448
Number of Logic Cells 3136
Number of Outputs 448 448
Number of Terminals 560 560
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 3136 CLBS, 55000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Temperature Grade OTHER
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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