XC4085XL-2BGG560C vs XC4062XLA-08BGG560I feature comparison

XC4085XL-2BGG560C AMD Xilinx

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XC4062XLA-08BGG560I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 560 560
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 85000 LOGIC GATES CAN ALSO USE 130000 GATES
Clock Frequency-Max 179 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 2304
Number of Equivalent Gates 55000 40000
Number of Inputs 448 384
Number of Outputs 448 384
Number of Terminals 560 560
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3136 CLBS, 55000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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Compare XC4062XLA-08BGG560I with alternatives