XC4085XL-2BGG560C
vs
XC4062XL-08BG560C
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
Package Description
LBGA,
Pin Count
560
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAX USABLE 85000 LOGIC GATES
TYPICAL GATES = 40000-130000
Clock Frequency-Max
179 MHz
238 MHz
Combinatorial Delay of a CLB-Max
1.5 ns
1.1 ns
JESD-30 Code
S-PBGA-B560
R-PBGA-B560
JESD-609 Code
e1
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3136
2304
Number of Equivalent Gates
55000
40000
Number of Inputs
448
384
Number of Outputs
448
384
Number of Terminals
560
560
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
3136 CLBS, 55000 GATES
2304 CLBS, 40000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Number of Logic Cells
2304
Package Equivalence Code
BGA560,33X33,50
Compare XC4085XL-2BGG560C with alternatives
Compare XC4062XL-08BG560C with alternatives