XC4036XL-09BG432C vs XC4052XLA-9BGG432C feature comparison

XC4036XL-09BG432C AMD Xilinx

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XC4052XLA-9BGG432C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TYPICAL GATES = 22000-65000
Clock Frequency-Max 217 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1.2 ns 1.1 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e0 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1296 1936
Number of Equivalent Gates 22000 33000
Number of Inputs 288
Number of Logic Cells 1296
Number of Outputs 288
Number of Terminals 432 432
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1296 CLBS, 22000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA HLBGA
Package Equivalence Code BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 40 mm 40 mm
Base Number Matches 1 1
Part Package Code BGA
Package Description HLBGA,
Pin Count 432

Compare XC4036XL-09BG432C with alternatives

Compare XC4052XLA-9BGG432C with alternatives