XC4052XLA-9BGG432C vs XC4062XL-08BG432C feature comparison

XC4052XLA-9BGG432C AMD Xilinx

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XC4062XL-08BG432C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description HLBGA,
Pin Count 432
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 227 MHz 238 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 2304
Number of Equivalent Gates 33000 40000
Number of Inputs 352 384
Number of Outputs 352 384
Number of Terminals 432 432
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1936 CLBS, 33000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HLBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 40 mm 40 mm
Base Number Matches 1 1
Additional Feature TYPICAL GATES = 40000-130000
Number of Logic Cells 2304

Compare XC4052XLA-9BGG432C with alternatives

Compare XC4062XL-08BG432C with alternatives