XC4036XL-09BG432C vs XC4036XLA-08BG432I feature comparison

XC4036XL-09BG432C AMD Xilinx

Buy Now Datasheet

XC4036XLA-08BG432I AMD Xilinx

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TYPICAL GATES = 22000-65000 CAN ALSO USE 65000 GATES
Clock Frequency-Max 217 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1.2 ns 1 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e0 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1296 1296
Number of Equivalent Gates 22000 22000
Number of Inputs 288 288
Number of Logic Cells 1296 1296
Number of Outputs 288 288
Number of Terminals 432 432
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1296 CLBS, 22000 GATES 1296 CLBS, 22000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Package Description PLASTIC, BGA-432
Pin Count 432

Compare XC4036XL-09BG432C with alternatives

Compare XC4036XLA-08BG432I with alternatives