Findchips: Compare XC3S2000-4FG900I vs XC3S2000-4FGG1156C

XC3S2000-4FG900I vs XC3S2000-4FGG1156C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	31 X 31 MM, FBGA-900	BGA,
Pin Count	900	1156
Reach Compliance Code	not_compliant	unknown
ECCN Code	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	23 Weeks
Clock Frequency-Max	630 MHz
Combinatorial Delay of a CLB-Max	0.61 ns
JESD-30 Code	S-PBGA-B900	S-PBGA-B1156
JESD-609 Code	e0
Length	31 mm	35 mm
Moisture Sensitivity Level	3
Number of CLBs	5120	192
Number of Equivalent Gates	2000000	50000
Number of Inputs	565
Number of Logic Cells	46080
Number of Outputs	565
Number of Terminals	900	1156
Organization	5120 CLBS, 2000000 GATES	192 CLBS, 50000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA900,30X30,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.6 mm	2.6 mm
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	31 mm	35 mm
Base Number Matches	1	1
Operating Temperature-Max		85 °C
Operating Temperature-Min
Temperature Grade		OTHER
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays