XC3S2000-4FG900I
vs
XC3S2000-4FGG900I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
31 X 31 MM, FBGA-900
31 X 31 MM, LEAD FREE, FBGA-900
Pin Count
900
900
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
23 Weeks
Clock Frequency-Max
630 MHz
630 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
0.61 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e0
e1
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
5120
5120
Number of Equivalent Gates
2000000
2000000
Number of Inputs
565
565
Number of Logic Cells
46080
46080
Number of Outputs
565
565
Number of Terminals
900
900
Organization
5120 CLBS, 2000000 GATES
5120 CLBS, 2000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
31 mm
Base Number Matches
2
2
Compare XC3S2000-4FG900I with alternatives
Compare XC3S2000-4FGG900I with alternatives