XC3S2000-4FGG1156C
vs
XC2V6000-6FFG1152I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA,
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count
1156
1152
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1152
Length
35 mm
35 mm
Number of CLBs
192
8448
Number of Equivalent Gates
50000
6000000
Number of Terminals
1156
1152
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
192 CLBS, 50000 GATES
8448 CLBS, 6000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
3.4 mm
Supply Voltage-Max
1.26 V
1.575 V
Supply Voltage-Min
1.14 V
1.425 V
Supply Voltage-Nom
1.2 V
1.5 V
Surface Mount
YES
YES
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max
820 MHz
Combinatorial Delay of a CLB-Max
0.35 ns
JESD-609 Code
e1
Moisture Sensitivity Level
4
Number of Inputs
824
Number of Outputs
824
Package Equivalence Code
BGA1152,34X34,40
Peak Reflow Temperature (Cel)
245
Technology
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Time@Peak Reflow Temperature-Max (s)
30
Compare XC3S2000-4FGG1156C with alternatives
Compare XC2V6000-6FFG1152I with alternatives