XC3S1500-4FG456I
vs
XC3S1400AN-4FG484C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, FBGA-456
FBGA-484
Pin Count
456
484
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
Clock Frequency-Max
630 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
0.71 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B484
JESD-609 Code
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3328
2816
Number of Equivalent Gates
1500000
1400000
Number of Inputs
333
375
Number of Logic Cells
29952
25344
Number of Outputs
333
288
Number of Terminals
456
484
Organization
3328 CLBS, 1500000 GATES
2816 CLBS, 1400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
23 mm
Base Number Matches
2
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
OTHER
Compare XC3S1500-4FG456I with alternatives
Compare XC3S1400AN-4FG484C with alternatives