XC3S1500-4FG456I
vs
XC3S1500-4FGG456C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, FBGA-456
23 X 23 MM, LEAD FREE, FBGA-456
Pin Count
456
456
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
52 Weeks
Clock Frequency-Max
630 MHz
630 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
0.61 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3328
3328
Number of Equivalent Gates
1500000
1500000
Number of Inputs
333
333
Number of Logic Cells
29952
29952
Number of Outputs
333
333
Number of Terminals
456
456
Organization
3328 CLBS, 1500000 GATES
3328 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
BGA456,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
OTHER
Compare XC3S1500-4FG456I with alternatives
Compare XC3S1500-4FGG456C with alternatives