XC3S1400AN-4FG484C
vs
XC3S1400AN-4FGG484C
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-484
FBGA-484
Pin Count
484
484
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
667 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.71 ns
0.71 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
Length
23 mm
23 mm
Moisture Sensitivity Level
3
Number of CLBs
2816
2816
Number of Equivalent Gates
1400000
1400000
Number of Inputs
375
375
Number of Logic Cells
25344
25344
Number of Outputs
288
288
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
2816 CLBS, 1400000 GATES
2816 CLBS, 1400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
1
1
ECCN Code
3A991.D
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare XC3S1400AN-4FG484C with alternatives
Compare XC3S1400AN-4FGG484C with alternatives