XC3390A-6PQ208I vs XC3064L-8TQ144I feature comparison

XC3390A-6PQ208I AMD Xilinx

Buy Now Datasheet

XC3064L-8TQ144I AMD Xilinx

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP QFP
Package Description FQFP, LFQFP, QFP144,.87SQ,20
Pin Count 208 144
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PQFP-G144
Length 28 mm 20 mm
Number of Terminals 208 144
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.6 mm
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 20 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature MAX USABLE 4500 LOGIC GATES
Clock Frequency-Max 80 MHz
Combinatorial Delay of a CLB-Max 6.7 ns
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of CLBs 224
Number of Equivalent Gates 3500
Number of Inputs 120
Number of Logic Cells 224
Number of Outputs 120
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 224 CLBS, 3500 GATES
Package Equivalence Code QFP144,.87SQ,20
Peak Reflow Temperature (Cel) 225
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3390A-6PQ208I with alternatives

Compare XC3064L-8TQ144I with alternatives