Findchips: Compare XC2VP7-5FG456I vs XC2VP7-7FGG456I

XC2VP7-5FG456I vs XC2VP7-7FGG456I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No	Yes
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, FBGA-456	BGA,
Pin Count	456	456
Reach Compliance Code	not_compliant	compliant
ECCN Code	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	1050 MHz	1350 MHz
Combinatorial Delay of a CLB-Max	0.36 ns	0.28 ns
JESD-30 Code	S-PBGA-B456	S-PBGA-B456
JESD-609 Code	e0	e1
Length	23 mm	23 mm
Moisture Sensitivity Level	3	3
Number of CLBs	1232	1232
Number of Inputs	248
Number of Logic Cells	11088
Number of Outputs	248
Number of Terminals	456	456
Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C
Organization	1232 CLBS	1232 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA456,22X22,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.6 mm	2.6 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	Tin/Lead (Sn63Pb37)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	23 mm	23 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays