XC2VP7-7FGG456I
vs
XC2VP7-6FG456C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA,
23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, FBGA-456
Pin Count
456
456
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1350 MHz
1200 MHz
Combinatorial Delay of a CLB-Max
0.28 ns
0.32 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1232
1232
Number of Terminals
456
456
Organization
1232 CLBS
1232 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
1
1
ECCN Code
3A991.D
Number of Inputs
248
Number of Logic Cells
11088
Number of Outputs
248
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Equivalence Code
BGA456,22X22,40
Temperature Grade
OTHER
Compare XC2VP7-7FGG456I with alternatives
Compare XC2VP7-6FG456C with alternatives