XC2VP7-5FG456I vs XC2VP7-6FG456C feature comparison

XC2VP7-5FG456I AMD Xilinx

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XC2VP7-6FG456C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, FBGA-456 23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, FBGA-456
Pin Count 456 456
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1050 MHz 1200 MHz
Combinatorial Delay of a CLB-Max 0.36 ns 0.32 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1232 1232
Number of Inputs 248 248
Number of Logic Cells 11088 11088
Number of Outputs 248 248
Number of Terminals 456 456
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1232 CLBS 1232 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Temperature Grade OTHER

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