XC2C32-3CPG56C
vs
XC2C32A-4CP56C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
6 X 6 MM, 0.50 MM PITCH, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count
56
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
Additional Feature
REAL DIGITAL DESIGN TECHNOLOGY
REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B56
S-PBGA-B56
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
6 mm
6 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
1
Number of I/O Lines
33
33
Number of Macro Cells
32
32
Number of Terminals
56
56
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1 DEDICATED INPUTS, 33 I/O
33 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA56,10X10,20
BGA56,10X10,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
240
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
3 ns
4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.35 mm
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
6 mm
6 mm
Base Number Matches
1
2
Samacsys Manufacturer
AMD
Clock Frequency-Max
450 MHz
Compare XC2C32-3CPG56C with alternatives