XC2C32-3CPG56C vs XC2C32A-6CPG56I feature comparison

XC2C32-3CPG56C AMD Xilinx

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XC2C32A-6CPG56I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56
Pin Count 56 56
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable YES YES
JESD-30 Code S-PBGA-B56 S-PBGA-B56
JESD-609 Code e1 e1
JTAG BST YES YES
Length 6 mm 6 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 1
Number of I/O Lines 33 33
Number of Macro Cells 32 32
Number of Terminals 56 56
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1 DEDICATED INPUTS, 33 I/O 33 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA56,10X10,20 BGA56,10X10,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 3 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 6 mm
Base Number Matches 1 2
Pbfree Code Yes
ECCN Code EAR99
Factory Lead Time 30 Weeks
Clock Frequency-Max 300 MHz

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