Part Details for XC2C32-3CPG56C by AMD Xilinx
Overview of XC2C32-3CPG56C by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for XC2C32-3CPG56C
XC2C32-3CPG56C CAD Models
XC2C32-3CPG56C Part Data Attributes
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XC2C32-3CPG56C
AMD Xilinx
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Datasheet
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XC2C32-3CPG56C
AMD Xilinx
Flash PLD, 3ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B56 | |
| JESD-609 Code | e1 | |
| JTAG BST | YES | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | 1 | |
| Number of I/O Lines | 33 | |
| Number of Macro Cells | 32 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1 DEDICATED INPUTS, 33 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FLASH PLD | |
| Propagation Delay | 3 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.35 mm | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6 mm |
Alternate Parts for XC2C32-3CPG56C
This table gives cross-reference parts and alternative options found for XC2C32-3CPG56C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2C32-3CPG56C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC2C32-4CPG56C | AMD Xilinx | Check for Price | Flash PLD, 4ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | XC2C32-3CPG56C vs XC2C32-4CPG56C |
| XC2C32A-6CPG56I | AMD Xilinx | Check for Price | Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | XC2C32-3CPG56C vs XC2C32A-6CPG56I |
| XC2C32-6CP56C | AMD Xilinx | Check for Price | Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | XC2C32-3CPG56C vs XC2C32-6CP56C |
| XC2C32-4CP56I | AMD Xilinx | Check for Price | Flash PLD, 4.5ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | XC2C32-3CPG56C vs XC2C32-4CP56I |
| XC2C32A-4CPG56C | AMD Xilinx | $3.1900 | Flash PLD, 4ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | XC2C32-3CPG56C vs XC2C32A-4CPG56C |