XC18V256VQG44C
vs
KM23C4100HFP2-10
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
QFP
QFP
Package Description
TQFP,
WQFP, TQFP44,.6SQ,32
Pin Count
44
44
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
15 ns
100 ns
JESD-30 Code
S-PQFP-G44
S-CQFP-G44
JESD-609 Code
e3
e0
Length
10 mm
10 mm
Memory Density
262144 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
MASK ROM
Memory Width
8
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
32768 words
262144 words
Number of Words Code
32000
256000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
256K16
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TQFP
WQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE
FLATPACK, WINDOW
Parallel/Serial
PARALLEL/SERIAL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
10 mm
Base Number Matches
1
1
Alternate Memory Width
8
Output Characteristics
3-STATE
Package Equivalence Code
TQFP44,.6SQ,32
Standby Current-Max
0.0001 A
Supply Current-Max
0.06 mA
Compare XC18V256VQG44C with alternatives
Compare KM23C4100HFP2-10 with alternatives