XC17256EPCG20C
vs
XC17128ELPCG20I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
XILINX INC
Part Package Code
QLCC
QLCC
Package Description
QCCJ,
QCCJ,
Pin Count
20
20
Reach Compliance Code
unknown
compliant
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
JESD-609 Code
e3
e3
Length
8.9662 mm
8.9662 mm
Memory Density
262144 bit
131072 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX1
128KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Supply Voltage-Max (Vsup)
5.25 V
3.6 V
Supply Voltage-Min (Vsup)
4.75 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
Width
8.9662 mm
8.9662 mm
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
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