XC1701LPDG8C
vs
AT17LV010-10PU
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
ATMEL CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
LEAD FREE, PLASTIC, DIP-8
|
0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
|
Clock Frequency-Max (fCLK) |
15 MHz
|
10 MHz
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
9.3599 mm
|
9.271 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1MX1
|
1MX1
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Power Supplies |
3.3 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.5974 mm
|
5.334 mm
|
Standby Current-Max |
0.00005 A
|
|
Supply Current-Max |
0.01 mA
|
0.01 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Samacsys Manufacturer |
|
Microchip
|
Write Protection |
|
HARDWARE
|
|
|
|
Compare XC1701LPDG8C with alternatives
Compare AT17LV010-10PU with alternatives