XA3S1000-4FTG256I
vs
XA3S1000-4FT256Q
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LEAD FREE, FTBGA-256
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
125 MHz
|
125 MHz
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G100
|
| JESD-609 Code |
e1
|
e0
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1920
|
|
| Number of Equivalent Gates |
1000000
|
|
| Number of Inputs |
391
|
391
|
| Number of Logic Cells |
17280
|
17280
|
| Number of Outputs |
391
|
391
|
| Number of Terminals |
256
|
100
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1920 CLBS, 1000000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
QFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
TQFP100,.63SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.55 mm
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XA3S1000-4FTG256I with alternatives
Compare XA3S1000-4FT256Q with alternatives