XA3S1000-4FT256Q vs XA3S1000-4FTG256Q feature comparison

XA3S1000-4FT256Q AMD Xilinx

Buy Now Datasheet

XA3S1000-4FTG256Q AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 125 MHz 125 MHz
JESD-30 Code S-PQFP-G100 S-PBGA-B256
JESD-609 Code e0 e1
Moisture Sensitivity Level 3 3
Number of Inputs 391 391
Number of Logic Cells 17280 17280
Number of Outputs 391 391
Number of Terminals 100 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LBGA
Package Equivalence Code TQFP100,.63SQ TQFP100,.63SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100 AEC-Q100
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 1
Part Package Code BGA
Package Description LEAD FREE, FTBGA-256
Pin Count 256
Length 17 mm
Number of CLBs 1920
Number of Equivalent Gates 1000000
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS, 1000000 GATES
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Temperature Grade AUTOMOTIVE
Width 17 mm

Compare XA3S1000-4FT256Q with alternatives

Compare XA3S1000-4FTG256Q with alternatives