X76F041WE-3 vs X76F400HI-2.5 feature comparison

X76F041WE-3 Xicor Inc

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X76F400HI-2.5 IC Microsystems Sdn Bhd

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer XICOR INC IC MICROSYSTEMS SDN BHD
Package Description WAFER DIE,
Reach Compliance Code unknown unknown
Additional Feature PASS SECURE FLASH DATA RETENTION = 100 YEARS
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
JESD-30 Code X-XUUC-N X-XUUC-N
Memory Density 4096 bit 4096 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Organization 512X8 512X8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code DIE
ECCN Code EAR99
HTS Code 8542.32.00.51
Data Retention Time-Min 100
JESD-609 Code e0
Terminal Finish TIN LEAD

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