X76F400HI-2.5 vs X76F400WI-2.5 feature comparison

X76F400HI-2.5 Xicor Inc

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X76F400WI-2.5 Xicor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC XICOR INC
Package Description DIE WAFER
Reach Compliance Code unknown unknown
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
JESD-30 Code X-XUUC-N X-XUUC-N
Memory Density 4096 bit 4096 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 512X8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 2 2

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Compare X76F400WI-2.5 with alternatives