X76F041WE-3
vs
X76F400WI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
XICOR INC
Package Description
WAFER
DIE,
Reach Compliance Code
unknown
unknown
Additional Feature
PASS SECURE FLASH
DATA RETENTION = 100 YEARS
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
4096 bit
4096 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
512X8
512X8
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
2
2
Data Retention Time-Min
100
Number of Terminals
5
Compare X76F041WE-3 with alternatives
Compare X76F400WI with alternatives