X76F041HG-3
vs
H1832CH
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
HUGHES AIRCRAFT
Part Package Code
DIE
Package Description
ROHS COMPLIANT, DIE
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Additional Feature
PASS SECURE FLASH
STATIC CMOS
Clock Frequency-Max (fCLK)
1 MHz
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
4096 bit
524288 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
512X8
64KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
Base Number Matches
1
1
Access Time-Max
200 ns
Output Characteristics
3-STATE
Supply Current-Max
0.065 mA
Compare X76F041HG-3 with alternatives
Compare H1832CH with alternatives