X24C16PMG
vs
SLE24C16-D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
SIEMENS A G
Part Package Code
DIP
DIP
Package Description
DIP,
,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.1 MHz
0.1 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
10.03 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
8 ms
Base Number Matches
1
2
Compare X24C16PMG with alternatives
Compare SLE24C16-D with alternatives