WSF512K16-39H2CA
vs
5962-9690102HXA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
WHITE MICROELECTRONICS
|
| Part Package Code |
PGA
|
|
| Package Description |
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66
|
|
| Pin Count |
66
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
SRAM IS ORGANISED AS 512K X 16
|
512K X 16 FLASH IS ALSO AVAILABLE
|
| JESD-30 Code |
S-CPGA-P66
|
S-CHIP-P66
|
| JESD-609 Code |
e0
|
e0
|
| Length |
35.2 mm
|
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
66
|
66
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
512KX16
|
512KX16
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.7 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
PERPENDICULAR
|
HEX
|
| Width |
35.2 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare WSF512K16-39H2CA with alternatives
Compare 5962-9690102HXA with alternatives