WS57C291B-50TMB vs 5962-8765001JC feature comparison

WS57C291B-50TMB Waferscale Integration Inc

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5962-8765001JC Teledyne e2v

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC E2V TECHNOLOGIES PLC
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 50 ns 50 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e4
Memory Density 16384 bit 16384 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 13.5 V 13.5 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Standby Current-Max 0.035 A 0.12 A
Supply Current-Max 0.035 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Part Package Code DIP
Package Description DIP, DIP24,.6
Pin Count 24

Compare WS57C291B-50TMB with alternatives

Compare 5962-8765001JC with alternatives