Part Details for WS57C291B-50TMB by Waferscale Integration Inc
Overview of WS57C291B-50TMB by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for WS57C291B-50TMB
WS57C291B-50TMB CAD Models
WS57C291B-50TMB Part Data Attributes
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WS57C291B-50TMB
Waferscale Integration Inc
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Datasheet
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WS57C291B-50TMB
Waferscale Integration Inc
UVPROM, 2KX8, 50ns, CMOS, CDIP24,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 50 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 2KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 13.5 V | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Standby Current-Max | 0.035 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for WS57C291B-50TMB
This table gives cross-reference parts and alternative options found for WS57C291B-50TMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C291B-50TMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PY291A-50WI | UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Pyramid Semiconductor Corporation | WS57C291B-50TMB vs PY291A-50WI |
5962-8765001LX | UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 | Teledyne e2v | WS57C291B-50TMB vs 5962-8765001LX |
5962-8765001JX | UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 | Teledyne e2v | WS57C291B-50TMB vs 5962-8765001JX |
5962-8765001JA | 2KX8 UVPROM, 50ns, CDIP24, CERAMIC, DIP-24 | STMicroelectronics | WS57C291B-50TMB vs 5962-8765001JA |
5962-8765001LC | UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | WS57C291B-50TMB vs 5962-8765001LC |
5962-8765001LX | 2KX8 UVPROM, 50ns, CDIP24, CERAMIC, DIP-24 | STMicroelectronics | WS57C291B-50TMB vs 5962-8765001LX |
5962-8765001LA | UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | WS57C291B-50TMB vs 5962-8765001LA |
5962-8765001LX | UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | WS57C291B-50TMB vs 5962-8765001LX |
PY291A-50WM | UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Pyramid Semiconductor Corporation | WS57C291B-50TMB vs PY291A-50WM |
5962-8765001LA | UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | WS57C291B-50TMB vs 5962-8765001LA |