5962-8765001JC
vs
5962-8765001LA
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
WAFERSCALE INTEGRATION INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
CERAMIC, DIP-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.61
|
8542.32.00.61
|
| Access Time-Max |
50 ns
|
50 ns
|
| JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e4
|
e0
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
UVPROM
|
UVPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
2KX8
|
2KX8
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
5
|
| Rohs Code |
|
No
|
| I/O Type |
|
COMMON
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
DIP24,.3
|
| Programming Voltage |
|
13.5 V
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Standby Current-Max |
|
0.12 A
|
| Supply Current-Max |
|
0.12 mA
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 5962-8765001JC with alternatives
Compare 5962-8765001LA with alternatives