WS512K32N-35G4TC
vs
HM465798K-9:RD
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
MERCURY SYSTEMS INC
|
ATMEL CORP
|
| Package Description |
40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
|
QCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
35 ns
|
35 ns
|
| Additional Feature |
USER CONFIGURABLE AS 2M X 8
|
|
| Alternate Memory Width |
16
|
|
| JESD-30 Code |
S-CQFP-F68
|
R-CQCC-N28
|
| JESD-609 Code |
e4
|
|
| Length |
39.6 mm
|
14 mm
|
| Memory Density |
16777216 bit
|
262144 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
28
|
| Number of Words |
524288 words
|
65536 words
|
| Number of Words Code |
512000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
512KX32
|
64KX4
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QCCN
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
2 mm
|
| Supply Current-Max |
0.66 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
39.6 mm
|
8.9154 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare WS512K32N-35G4TC with alternatives
Compare HM465798K-9:RD with alternatives